Description
Wafer Inspection (100-300mm) – MVP 900 W/ALW:
Wafer Inspection (100-300mm) – MVP 900 W/ALW:
Key Features:
- 2D and 3D Capable
- 100, 150, 200 and 300mm Wafers
- 0.35um to > 3.4um Optical Resolution
- Surface Inspection
- Bump Inspection 25um to 500um
- Multi-Spectral Lighting
- Real-Time Process Monitoring
Options:
- High Resolution Laser Profiler
- Manual Loading
- Automatic Loading
- 3rd Party Handlers for SMIF, FOUP
- Vacuum
- SECS/GEM
- XML Map Output for Downstream Sorting
- Ink Marking for Defect Locations
