Description
ATPremier MEM PLUS™ – enables high i/o and low cost Memory Packaging
The ATPremier MEM PLUS™ is our latest wafer-level packaging solution to meet the demands of today’s memory packaging. Leveraging K&S’ innovative Vertical Wire Technology, it delivers breakthrough performance for next-generation DRAM and NAND assembly.
- Highest Throughput and Lowest CoO
- Latest Response-Based Processes for Memory Applications
- New Advanced Optical System and Inspection Capabilities
- Single Bonder Solution for 8″ and 12″ Wafer
- Capability to Integrate Auto Wafer Handler or EFEM for Factory Automation
