Description
ADVANCED TECHNOLOGY WAFER LEVEL BONDER
ATPremier LITE™ – The Smart Choice for Cost and Performance
Building on the proven success of the Power Series, the ATPremier LITE™ brings advanced stud bumping to wafer level packaging. Engineered for productivity, it inherits the superior performance of the ATPremier PLUS™ while offering a more cost-effective solution.
Key Features
- Bonding Capability:
- Handles Wafers from 4″ to 12”, up to 200 mm Diameter Wafers, Ceramics, or Substrates
- 4″ Dual Ramp Chuck Option
- Bond Placement Accuracy:
- ±3.5µm @3 sigma (200mm Work Piece)
- Gold Bumping: Best-in-Class Low Temperature Gold Bumping
- Serviceability: Improved Serviceability with Easy Access to Lower Console
- Power Supply: Programmable Power Supply System with Back-Up
- Upgradeable:
- Optional Copper or Silver Alloy Capability and Kits
- Compact Design: Smallest Footprint in the Market
