Description

High Performance 3D SPI – MVP Versa Duo

MVP’s new Cross Platform, High Performance 3D SPI Solution

The first part of any SMT process is Paste. MVPs Versa Platform provides high accuracy paste inspection. High accuracy paste measurements are made using a choice of 12um or 5um 3D measurement systems.

MVPs latest Versa Duo is our flagship 2D/3D system offers lightning-fast inspection ideal for hybrid assemblies, paste applications, and high-speed SMT.

With Versa Duo, enjoy swift programming and seamless integration into every stage of your production line.

• Highest Accuracies at the fastest throughputs
• “on the fly” 3D solder paste metrology
• Full Line Integration and feedback to Printers
• Built in barcode reading for traceability
• Fastest Programming

MVP’s solutions allow you to merge stencil and placement data and standard inspection criteria.

For inspection, a single setup for all measurements, the same tool measures:

• Height (Presence/Absence)
• Bridging
• Position/Translation
• Paste Height and Volume

• Key Features

  • Versatile Capabilities That Cover, in a Single Platform Paste, Pre-Reflow, Post-Reflow, Post-Wave, BGA
  • 12 Megapixel Color Camera with 3D Lighting w/ Standard 5-10um pixel resolution
  • Laser Based 3D Capability w/ 1um Repeatability
  • Standard Software Platform for all Places in the line
  • Linear axis and 0.5 micron linear encoders
  • Fast Programming Generation using ePro and Validate
  • Import capabilities include Gerber, ODB++ and a variety of other formats