Capillaries – VERSACAP

VersaCap™ Performance Benefits:

• ​High ease-of-fit into running or newly optimized application process
• Reliable stitch bond quality maintained over time
• Reduced cost-of-ownership

VersaCap™ Product Characteristics:

• Material platform: ITX, mature superior quality ceramics composite
• Geometrical specifications: optimized for low-pin count applications
• Unique feature: C2 tip finish type
• Able to fit into K&S or other capillary parametric window
  
  VersaCap™ Application Range:

  • Device types: predominantly LED and discrete (all types)
  • Bond pad pitch range [μm]: 120 – 300
  • Wire diameter range [mil]: 0.8 – 2.5
  • Ball bonder models: all
    
    Mass Production Performance 3528 RGB LED Bonding Process Conditions:

    • Device – SMD LED 3528, min BPO 45 [µm]
    • Bonder – K&S ConnX-LED
    • Wire – 0.8 [mil], bare Cu
    • Test sample size – 23 capillaries on 15 bonders

    Results:

    • VersaCap enables to extend the production capillary lifespan by 600 KB
    • The stitch bond quality of VersaCap remains well above the 6 grams force  throughout the whole production run
    • VersaCap demonstrates statistically superior usability at mass production tests
    • An average of 960 K bonds for VersaCap compared to 480 K bonds
    • VersaCap stitch bond imprint quality is maintained throughout the entire life test

    Mass Production Performance 2121 RGB LED Bonding Process Conditions:

    • Device – RGB LED 2121, min BPO 45 [µm]
    • Bonder – K&S ConnX-LED
    • Wire – 0.7 [mil], bare Cu
    • Test sample size – 4 capillaries on 4 bonders

    Results:

    • VersaCap outperforms the competitor’s capillary at lifespan test, reaching an average of 1,250 K bonds