Capillaries -Teracap


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Description

CAPILLARY SOLUTION FOR ADVANCED MEMORY & LOGIC DEVICES

TeraCap™ is the latest capillary series for advanced memory and logic devices packaging using either gold or silve wire.

TeraCap™ Major Benefits:

  • ​Excellent bonding and looping consistency (yield)
  • Superior workability (MTBA – more bonds per hour)
  • Extended durability (more bonds per capillary)

TeraCap™ Key Attributes:

  • ​​New iZX high quality composite ceramics
  • Tighter control over critical dimensions -0/+1 [μm]
  • Designed specifically for various memory devices structures (stacked, deep access, overhang), and bonding modes
    TeraCap™ Application Range:

    • Bond pad pitch [μm]: 40 – 120
    • Wire diameter [μm]: 15 – 33
    • Wire type: any gold and silver alloy wire
    • Device types: any memory and logic devices