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Description
CHIP-TO-WAFER (C2W)
The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).
Cost-of-Ownership Advantage
Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
C2W Features & Benefits:
- Automation
- Control
- Placement Accuracy
- Performance
- Yield Enhancement
- Adaptability
- Cost-of-Ownership Advantage
