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Description
ABT 2000W
Wafer Level Bond Tester:
Multifunction Fully-automatic Bond Tester
Features:
∙ High WPH ( up to 25pcs)
∙ High Shear height accuracy(up to ±0.5um)
∙ Advanced technology, Bond Tester industry-leading
∙ Includes Automatic PR system and Motion control System
∙ Accuracy ±0.1%FS
∙ Function: Bump/Ball Shear wafer level.
∙ Application: Fab/ Advance packing/ Bumping.
∙ Global unique
∙ Fully-automatic: 24×7 hours
