IC Packaging – Open Cavity package

At Zara Tech, we specialize in providing top-notch IC packaging assembly services for open cavity packages, tailored to meet the diverse needs of industries across India. Our expertise ensures optimal performance, reliability, and protection for your integrated circuits.

Why Choose Our Open Cavity Packaging Services?

• Precision Engineering: We employ advanced techniques for die attach, wire bonding, and lid assembly, ensuring secure and robust connections for your ICs.
• Material Versatility: From ceramic to plastic packages, we offer solutions that cater to thermal dissipation, electrical insulation, and mechanical strength requirements.
• Custom Solutions: Whether it’s high-power RF devices or cost-effective options, our team delivers tailored solutions to match your specific needs.
• Quick Turnaround: We understand the urgency of your projects and offer a fast, efficient assembly process with a quick turn in just 3 days.
• Quality Assurance: Our meticulous processes, including encapsulation and laser marking, guarantee the integrity and traceability of your ICs.

Our Process:

1. Die Attach: Precise alignment and bonding of the IC die to the package for reliable electrical connections.
2. Wire Bonding: Advanced techniques to establish secure electrical pathways between the die and package leads.
3. Encapsulation: Sealing the package with precision to protect against environmental factors and contaminants.
4. Marking: Clear and permanent identification for easy traceability.

With a commitment to excellence and innovation, Zara Tech is your trusted partner for IC packaging assembly in India.

Contact us today to learn more about how we can support your projects!